What happened
On September 8, ASML and TSMC announced a joint industry cooperation plan to upgrade high-NA EUV photomasks from 6-inch to 12-inch, aiming to improve wafer fab efficiency, reduce chip manufacturing costs, and eliminate stitching limitations.
The plan targets a 12-inch photomask trial production line by 2031, and by 2033, the 12-inch high-NA EUV lithography system is expected to be used in advanced process mass production. TSMC anticipates large-scale application of ASML's high-NA technology in advanced processes starting in 2030.
The semiconductor sector saw mixed trading, with the STAR Chip ETF (588290), which tracks the sector and has the lowest fee among similar indices, up 43.07% year-to-date. Individual stocks like Anji Technology rose 3.70%, VeriSilicon rose 2.16%, and Yuanjie Technology rose 0.71%.
Why it matters
This collaboration signals a major step forward in semiconductor manufacturing technology, potentially lowering costs and boosting efficiency for advanced chips, which is crucial as AI drives global capital expenditure expansion in the industry.
TSMC's increasing equipment procurement indicates that AI demand is accelerating through to wafer fabrication capacity and equipment investment, lifting the global semiconductor equipment sector. This trend is expected to benefit front-end equipment, core components, and advanced packaging equipment suppliers.
Key facts
ASML and TSMC announced a cooperation plan on September 8 to upgrade high-NA EUV photomasks from 6-inch to 12-inch.
The plan aims to have a 12-inch photomask trial production line by 2031 and 12-inch high-NA EUV systems in mass production by 2033.
TSMC expects to use ASML's high-NA technology in advanced processes on a large scale starting in 2030.
The STAR Chip ETF (588290) has gained 43.07% year-to-date as of the report time.
What to watch next
Watch for further announcements from ASML and TSMC on the progress of the 12-inch photomask and high-NA EUV adoption, which could signal broader industry shifts.
Monitor semiconductor equipment and advanced packaging stocks, as AI-driven demand is expected to continue fueling investment and innovation in these areas.