What happened
Huawei unveiled the Mate XT 2, a tri-fold flagship phone, in Guangzhou on September 7, featuring the Kirin 9050 Pro chip, the first to use logic-folding technology. The company claims a 42% performance improvement over the previous Mate XTs model.
Xiaomi released the 18 Fold, its first mass-produced phone priced above 10,000 yuan, powered by its self-developed Xuanjie O3 AI processor built on a 3nm process. It is also the first phone to use CXMT LPDDR6 memory.
China's Ministry of Industry and Information Technology issued the 15th Five-Year Plan for the information and communication industry, targeting full coverage of next-gen networks by 2030, with plans to start 6G commercial use and promote eSIM and network-free communication.
Why it matters
The simultaneous launch of new foldable phones with cutting-edge chips signals intense competition in the high-end smartphone market, with both companies pushing technological boundaries.
The policy plan outlines ambitious infrastructure goals, including significant investment and adoption targets, which could shape the future of digital connectivity in China.
The introduction of logic-folding chip technology may represent a new direction in semiconductor design, potentially impacting performance and efficiency in mobile devices.
Key facts
Huawei's Mate XT 2 uses the Kirin 9050 Pro chip, the first with logic-folding technology, and is 42% faster than the Mate XTs.
Xiaomi's 18 Fold is the company's first phone to exceed 10,000 yuan in starting price and features the 3nm Xuanjie O3 processor.
The 15th Five-Year Plan for ICT aims for a 95% 5G (including 5G-A) user penetration rate and 9,800 EFLOPS of intelligent computing power by 2030.
What to watch next
How consumers respond to the premium pricing of these new foldable phones and whether they drive market growth.
The actual implementation of the ICT plan, including the timeline for 6G rollout and the adoption of new technologies like eSIM.
Potential follow-up innovations in chip technology as companies explore logic-folding and other advanced manufacturing techniques.