What happened
On September 8, Inno Laser held an online performance briefing for the first half of 2026, attended by investors via the internet.
Company executives, including the chairman and general manager, responded to questions about their IC substrate-related products and order status.
Why it matters
The company's ultra-fast laser drilling equipment, capable of drilling micro-holes in various substrate materials, could be pivotal for advanced packaging and IC substrate manufacturing.
Investor interest in revenue projections for this product line suggests its potential impact on the company's near-term financial performance.
Key facts
Inno Laser's ultra-fast laser drilling equipment can process micro-hole diameters of 30-100 micrometers.
The equipment achieves a maximum drilling speed exceeding 10,000 holes per second.
It is compatible with substrate materials such as ABF, CBF, BT, M9, ceramic, Q cloth, and PTF.
What to watch next
Future announcements may provide more details on order volumes and expected revenue contributions from IC substrate products.
The company's ability to scale production and meet demand in the IC substrate market will be a key factor to monitor.
